What is PoLinker™?
A functional polymer used in formulation of compounds as coupling agent, polymer modifier, dispersing aid, adhesion promoter or hot melt adhesive. The PoLinkerTM family includes many grades which based on different polymers to match what they needed. Certain grades have different product types depending on the applications.
Coupling Agent
Using PoLinkerTM in thermoplastic compounds as a coupling agent to improve the compatibility between polymer and filler which can enhance the mechanical properties of compound.
Grade | Base Polymer | Melt Flow Index |
---|---|---|
PL1010 | PP | 80 (190℃/2.16kg) |
Polymer Modifier
Adding PoLinkerTM to polymer can improve its toughness without affecting thermal properties. It is an effective impact modifier, especially in PA or PC.
Grade | Base Polymer | Melt Flow Index |
---|---|---|
PL2103 | TPO | 1.5 (230℃/2.16Kg) |
PL3010 | HDPE | 30 (190℃/2.16Kg) |
PL3430 | LLDPE | 1 (190℃/2.16Kg) |
PL5110 | EPDM | 0.4 (190℃/2.16Kg) |
Adhesion promoter
An adhesion promoter will act effectively at the interface of different substrates to chemically and physically wed these dissimilar materials into a strong cohesive bond structure. PoLinkerTM can be an adhesion promoter between polymer and polymer, or polymer and inorganic substrate to enhance adhesion between the two materials.
Grade | Base Polymer | Applications |
---|---|---|
PL1051 | TPO | 31 (230℃/2.16Kg) |
PL1052 | TPO | 240 (230℃/2.16Kg) |
PL6250 | SEBS | 30 (230℃/5Kg) |
PL1052S | TPO | - |
PL2400ST | TPO | - |
PL2470S | TPO | - |
PL2470ST | TPO | - |
Hot Melt Adhesive
PoLinkerTM hot melt adhesives originates from functionalized thermoplastic olefin (TPO) which offer a bonding solution between TPO and other substrates as a tie layer by lamination or co-extrusion.
Grade | Base Polymer | Melt Flow Index (190℃/2.16kg) | Thickness (mm) | Width (mm) |
---|---|---|---|---|
PL2400 | TPO | 30 | - | - |
PL2400F | TPO | - | 0.3 | 1,000 |
Aqueous Polyolefin Dispersion
PoLinkerTM is dispersed in water with extremely small particle sizes and can be used in coating or dipping processes to reduce film thickness which is an alternative solution of solvent-based adhesives.
Grade | Base Polymer | Viscosity | Solid content |
---|---|---|---|
PL2470D | TPO | 1000 - 4000 cP | 45±3% |